Research News - Ali Nassiri

Posted: July 3, 2017

Ali Nassiri, a SIMCenter research scientist, recently received the honor of publication in the prestigious journal, Applied Physics Letters, a weekly journal published by the American Institute of Physics. His paper, "Depiction of interfacial morphology in impact welded Ti/Cu bimetallic systems using smoothed particle hydrodynamics" can be found in issue 23 and is featured on the cover. The work was also presented at the 2017 North American Manufacturing Research Conference in Los Angeles, California.

Nassiri's research is focused on computational materials joining, specifically high velocity impact welding (HVIW) processes. "To support the lightweighting aim in the automotive, aerospace, appliances, and medical device industries, HVIW can be used to join dissimilar metals. The manufacturing industry often relies on numerical simulations to reduce the number of trial-and-error iterations required during the process development to reduce costs. However, this can be difficult in high strain manufacturing processes where extremely high plastic strain regions develop. Thus, a traditional Langrangian analysis is not able to accurately model the process due to excessive element distortion," he explains.

To address these issues, he has developed and employed different computational platforms including arbitrary Lagrangian-Eulerian (ALE), coupled Eulerian-Langrangian (CEL), and smoothed particle hydrodynamics (SPH) to simulate the interface between welded materials.

The recent work, which was sponsored by Honda R&D North Americas, Inc., successfully simulated the interface between copper and titanium using the SPH method. Summarizing, Nassiri shares, "The results were in good agreement with the experimental tests conducted by vaporing foil actuator welding.” 

The full text of the paper is accessible on the American Institute of Physics website.


Category: Research