New High-Temperature Testing Procedure
High-temperature stress-strain curves are essential input to numerical simulation of manufacturing processes such as welding, additive manufacturing and forging. A group of researchers, comprising Mr. Alexey Kuprienko (MS student), Ms. Ying Lu (PhD student), Dr. Daniel Tung (currently Sandia National Laboratories) and Prof. Wei Zhang, all with Dept. of Materials Science and Engineering, recently developed a unique high-temperature testing procedure based on Gleeble® and digital image correlation (DIC). Compared to the standard testing procedure, the new procedure has the following advantages:
- Rapid heating (up to 10,000 K/s) to testing temperature and quenching after hot deformation to preserve deformed microstructure
- Use of complex thermal and mechanical loading cycles such as heating, holding, and tensioning during cooling
- Measurement of local strain using DIC making it suitable for testing specimens with spatially non-uniform property such as a weld joint
- High-sensitive load cell suitable for sheet metals such as advanced high-strength steels
- Slow to high strain rates (up to ~10 s-1)
- Temperature up to 1473 K (1200 C or 2192 F)
The animation in Figure 1 shows the local strain map generated using DIC during testing at 1373 K (1100 °C or 2012 °F). The corresponding true stress-strain curve is shown in Figure 2.
For more information about the test, please contact Prof. Wei Zhang at zhang.3978@osu.edu.
Figure 1: Accurate measurement of local strain using DIC during high-temperature testing
Figure 2: True stress-strain curve for a low alloy steel tested at 1373 K (1100 °C or 2012 °F)
